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晶体谐振器
AS 系列（1210 AnSn）
·Ultra-small and Low profile 1.2x1.0x0.3 mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Mobile Communications ，Bluetooth，Wireless LAN
1S 系列 (1612)
·Ultra-small and Low profile 1.6x1.2x0.35mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Mobile Communications ，Bluetooth，Wireless LAN
9S 系列 (2016)
·Ultra-small and Low profile 2.0x1.6x0.45mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Mobile Communications ，Bluetooth，Wireless LAN
2S 系列 (2520)
Features :
·Small and Low profile 2.5x2.0x0.6mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Digital Electronics & Industrial field
·Consumer products
3S 系列 (3225)
Features :
·Small and Low profile 3.2x2.5x0.7mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Digital Electronics & Industrial field
·Consumer products
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