Our products and solutions can provide stable clock signals for various devices, achieve 5G and 5G Advanced network speeds, provide precise positioning of autonomous vehicles, and meet the synchronization requirements of cloud computing.
AS 系列(1210 AnSn)
·Ultra-small and Low profile 1.2x1.0x0.3 mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Mobile Communications ,Bluetooth,Wireless LAN
1S 系列 (1612)
·Ultra-small and Low profile 1.6x1.2x0.35mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Mobile Communications ,Bluetooth,Wireless LAN
9S 系列 (2016)
·Ultra-small and Low profile 2.0x1.6x0.45mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Mobile Communications ,Bluetooth,Wireless LAN
2S 系列 (2520)
Features :
·Small and Low profile 2.5x2.0x0.6mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Digital Electronics & Industrial field
·Consumer products
3S 系列 (3225)
Features :
·Small and Low profile 3.2x2.5x0.7mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Digital Electronics & Industrial field
·Consumer products